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| ．Dimensions |
| Size : 2 ~ 4” |
| Thickness：0.381~0.635mm |
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| ．Thin-film Thickness |
| Cu：25 ~ 50μm |
| Ni：3 ~ 5μm |
| Au：0.13 ~ 0.2μm |
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| ．Thermal Conductivity |
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| ．Coff. of Thermal Expansion |
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| ．Volume Resistivity |
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Application |
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| ．Heat Dissipation for High Power LED |
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．Heat Dissipation for Concentrating Photovoltaic |
| ．Power Chip for High Voltage Devices |
．Lighting Transistor for LD |
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